ConferenceEngineering And Technology
International Conference on Electronics Packaging and Assembly Engineering
Event Starts
51Days
22Hours
41Minutes
28Seconds
IC-EPAE
Mon, Aug 10, 2026- Tue, Aug 11, 2026
Taichung City, Taiwan
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
Deadline: Jul 21, 2026
IC-EPAE
Mon, Aug 10, 2026- Tue, Aug 11, 2026
Taichung City, Taiwan
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
Deadline: Jul 21, 2026
Objective of the Conference
The main purpose of International Conference on Electronics Packaging and Assembly Engineering is to bring industry professionals, experts, academicians, and scholars to discuss their expertise for better collaboration in the field.
Important Dates
Start Date
Monday, August 10, 2026
End Date
Tuesday, August 11, 2026
Registration Deadline
Sunday, July 26, 2026
Submission Deadline
Tuesday, July 21, 2026
Conference Agenda
| Timing | Sessions |
|---|---|
| 09:00 AM – 09:30 AM | Registration & Welcome Coffee Kit Collection |
| 09:30 AM – 09:45 AM | Networking Tea Break |
| 09:45 AM – 10:30 AM | Opening Plenary Session: Welcome Address & Keynote |
| 10:30 AM – 01:00 PM | Session I |
| 01:00 PM – 01:30 PM | Lunch Break |
| 01:30 PM – 04:00 PM | Session II |
| 04:05 PM – 04:15 PM | Group Photo & Final Networking Session |
| 04:15 PM – 05:00 PM | Closing Address: Reflections & Awards Presentation |
Organizer
